FHD 0.39″ OLED Micro Display 1920X1080 For AR Type-c Board
FHD 0.39" OLED Micro Display 1920x1080 with Type-C Driver Board Overview and Applications
The B039FH8A0 is an advanced 0.39-inch Full HD OLED micro display offering a compact form factor with exceptional visual performance. Featuring a resolution of 1920 x 1080 pixels and powered by an active matrix organic light-emitting diode (OLED) module, the display integrates pixel circuits and driving ICs directly on a single-crystal silicon backplane. This integration ensures ultra-low power consumption and precise performance, making the display ideal for applications such as:
- Augmented Reality (AR) and Virtual Reality (VR) Systems
- Head-Mounted Displays (HMDs)
- Near-Eye Displays (NEDs)
Designed for immersive visual applications, this micro display delivers sharp, vibrant, and high-contrast imagery while maintaining an ultra-thin and lightweight structure.
Key Features
High Resolution and Compact Design
The B039FH8A0 delivers an impressive 5644 PPI (Pixels Per Inch) within its small 0.39-inch diagonal display size. With a full-color range of 16.7 million colors, it offers outstanding detail and clarity for virtual and augmented reality environments.
Performance and Functionality
- Fast Response Time: Ensures smooth motion handling with minimal lag, critical for AR/VR applications.
- Color Enhancement & Sharpness Optimization: Advanced algorithms improve image quality for a more immersive experience.
- High Contrast and Fluency Modes: Achieves deep blacks and vibrant colors, enhancing visual impact.
- Power-Saving Modes: Optimized energy efficiency for longer operational duration.
- Flexible Scan Direction: Allows upward or downward scanning, adapting to diverse integration scenarios.
Connectivity and Interface
Supporting MIPI-only or MIPI+I2C interfaces, the display module ensures flexible and seamless integration into modern electronic systems. A dedicated Type-C driver board simplifies connectivity for advanced device applications.
Technical Specifications
The table below summarizes the general specifications of the B039FH8A0 OLED micro display:
| Specification | Details |
|---|---|
| Display Mode | MICRO SI-OLED display |
| Interface | 60 Pins, MIPI or MIPI+I2C |
| Resolution | 1920 x 1080 (Full HD) |
| Panel Size | 20 x 10 x 25 mm |
| Active Area | 8.75 x 4.97 mm |
| Operating Temperature | -10°C to 70°C |
| Driver Board | Type-C Board |
| Pin Count | 60 Pins |
Functional Description
Compact Integration for AR/VR Displays
The B039FH8A0 micro display leverages silicon backplane technology to integrate both pixel driving circuits and ICs on a compact substrate. This innovation minimizes power consumption while delivering an ultra-compact form factor, perfect for head-mounted AR/VR systems where space is a premium.
Visual Performance
With its FHD resolution, the display provides exceptional pixel density and sharpness, ensuring a lifelike visual experience. The combination of color enhancement, sharpness optimization, and high contrast mode makes it ideal for environments demanding vibrant visuals and high fidelity.
Operational Flexibility
The display supports dual interface configurations (MIPI or MIPI+I2C), allowing flexible integration into various embedded systems. Its programmable scan direction ensures compatibility across different device orientations, offering additional versatility in design and deployment.
Applications
AR/VR Systems
With its compact size, high resolution, and fast response, the B039FH8A0 is well-suited for AR/VR headsets. It delivers smooth motion visuals and immersive graphics critical for virtual reality experiences.
Near-Eye Displays (NEDs)
The ultra-small form factor and high pixel density enable NED systems to achieve precise visuals, catering to medical, industrial, and consumer electronics applications.
Wearable Displays
Its thin and lightweight profile makes the B039FH8A0 a perfect candidate for next-generation wearable devices, combining low power consumption with high-quality visuals.
Conclusion
The B039FH8A0 OLED Micro Display represents a significant advancement in compact display technology, offering Full HD resolution, high pixel density, and ultra-efficient performance. Its versatility, enhanced features, and robust specifications make it the ideal solution for modern AR/VR systems and other near-eye display applications. By leveraging its compact design and advanced interface support, developers and designers can integrate this display into cutting-edge products that demand both quality and efficiency.
Drawing
Pin Description
| PIN No. (FPC Side) | Symbol | Type | Description |
|---|---|---|---|
| 1 | GND | Power Supply | Circuit ground |
| 2 | GND | Power Supply | Circuit ground |
| 3 | TEST PIN 1 | Input | TEST pin (no connect, Floating) |
| 4 | VREF2 | Output | VREF voltage. Connect a capacitor for stabilization |
| 5 | VREF3 | Output | VREF voltage. Connect a capacitor for stabilization |
| 6 | VGMP | Output | Gamma top voltage. Connect a capacitor for stabilization |
| 7 | VGSP | Output | Gamma bottom voltage. Connect a capacitor for stabilization |
| 8 | AVEE | Power Supply | Power supply for OLED cell. Connect a capacitor for stabilization |
| 9 | VREF1 | Output | VREF voltage. Connect a capacitor for stabilization |
| 10 | IM [0] | Input | Use to select the Interface type. |
| IM [0] Command Execute Image Write | |||
| 0 – MIPI | |||
| 1 – I2C/MIPI | |||
| Note: MIPI 1port or 2port is selected by register setting | |||
| 11 | OTP_SEL | Input | MTP type selection. OTP_SEL, connect to GND: use internal OTP |
| 12 | OCP_OUT | Output | Over current protect flag |
| 13 | TEST PIN 2 | Input | TEST pin. Connect to GND |
| 14 | SDA | Input/Output | Bi-direction data PIN in I2C I/F. If this pin is not used, connect to VDDI |
| 15 | SCL_WRX | Input | Synchronous clock signal in I2C I/F. If this pin is not used, connect to VDDI |
| 16 | TEST PIN 3 | Output | TEST pin (no connect, Floating) |
| 17 | TEST PIN 4 | Input/Output | TEST pin (no connect, Floating) |
| 18 | RESX | Input | This signal will reset the device and must be applied to properly initialize |
| the chip. Signal is active low | |||
| 19 | MVDDL | Output | Internal system Power. Connect a capacitor for stabilization |
| 20 | MVDD | Output | Internal system Power. Connect a capacitor for stabilization |
| 21 | GND | Power Supply | Circuit ground |
| 22 | VDDI | Power Supply | External power supply (1.8V for digital system power) |
| 23 | DVDD | Output | Internal system Power. Connect a capacitor for stabilization |
| 24 | DVDD | Output | Internal system Power. Connect a capacitor for stabilization |
| 25 | AVDD | Power Supply | Power supply for OLED cell. Connect a capacitor for stabilization |
| 26 | ELVDD | Output | Power supply for OLED cell. Connect a capacitor for stabilization |
| 27 | VCOM | Output | Power supply for OLED cell. Connect a capacitor for stabilization |
| 28 | VCOM | Output | Power supply for OLED cell. Connect a capacitor for stabilization |
| 29 | GND | Power Supply | Circuit ground |
| 30 | GND | Power Supply | Circuit ground |
| 31 | GND | Input | Circuit ground for MIPI |
| 32 | DATAP2_PTA | Input | Differential small amplitude signal of MIPI data input |
| 33 | DATAN2_PTA | Input | Differential small amplitude signal of MIPI data input |
| 34 | GND | Input | Circuit ground for MIPI |
| 35 | DATAP1_PTA | Input | Differential small amplitude signal of MIPI data input |
| 36 | DATAN1_PTA | Input | Differential small amplitude signal of MIPI data input |
| 37 | GND | Input | Circuit ground for MIPI |
| 38 | CLKP_PTA | Input | MIPI CLK |
| 39 | CLKN_PTA | Input | MIPI CLK |
| 40 | GND | Input | Circuit ground for MIPI |
| 41 | DATAP0_PTA | Input/Output | Differential small amplitude signal of MIPI data input |
| 42 | DATAN0_PTA | Input/Output | Differential small amplitude signal of MIPI data input |
| 43 | GND | Input | Circuit ground for MIPI |
| 44 | DATAP3_PTA | Input | Differential small amplitude signal of MIPI data input |
| 45 | DATAN3_PTA | Input | Differential small amplitude signal of MIPI data input |
| 46 | GND | Input | Circuit ground for MIPI |
| 47 | DATAP2_PTB | Input | Differential small amplitude signal of MIPI data input |
| 48 | DATAN2_PTB | Input | Differential small amplitude signal of MIPI data input |
| 49 | GND | Input | Circuit ground for MIPI |
| 50 | DATAP1_PTB | Input | Differential small amplitude signal of MIPI data input |
| 51 | DATAN1_PTB | Input | Differential small amplitude signal of MIPI data input |
| 52 | GND | Input | Circuit ground for MIPI |
| 53 | CLKP_PTB | Input | MIPI CLK |
| 54 | CLKN_PTB | Input | MIPI CLK |
| 55 | GND | Input | Circuit ground for MIPI |
| 56 | DATAP0_PTB | Input/Output | Differential small amplitude signal of MIPI data input |
| 57 | DATAN0_PTB | Input/Output | Differential small amplitude signal of MIPI data input |
| 58 | GND | Input | Circuit ground for MIPI |
| 59 | DATAP3_PTB | Input | Differential small amplitude signal of MIPI data input |
| 60 | DATAN3_PTB | Input | Differential small amplitude signal of MIPI data input |
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Frequently Asked Question
The display has a 1920×1080 Full HD resolution with a diagonal size of 0.39 inches.
The display’s high pixel density (5644 PPI), fast response time, compact form factor, and vibrant color performance make it ideal for immersive AR/VR headsets and near-eye displays.
It supports MIPI-only or MIPI+I2C interfaces, allowing flexibility for integration with various devices.
Key features include:
- Fast response time
- Color and sharpness enhancements
- High contrast and fluency modes
- Power-saving mode
- Scan direction flexibility
The silicon backplane integrates pixel circuits and driving ICs, reducing power consumption and enabling a compact size suitable for space-constrained devices.
The B039FH8A0 operates within a temperature range of -10°C to 70°C, ensuring reliable performance under varying conditions.
The panel size is 20x10x25 mm, and the active display area measures 8.75×4.97 mm.
The display uses a Type-C driver board and requires a 60-pin connector for interface and power connectivity.
The display is ideal for:
- Augmented Reality (AR) and Virtual Reality (VR) headsets
- Near-Eye Displays (NEDs)
- Wearable head-mounted devices
The power-saving (PS) mode reduces energy consumption, extending battery life in portable and wearable applications while maintaining display quality.
